Development of a Low-Dielectric-Constant Polymer for the Fabrication of Integrated Circuit Interconnect

✍ Scribed by S. J. Martin; J. P. Godschalx; M. E. Mills; E. O. Shaffer II; P. H. Townsend

• Publisher: John Wiley and Sons
• Year: 2000
• Tongue: English
• Weight: 429 KB
• Volume: 12
• Category: Article
• ISSN: 0935-9648
• DOI: 10.1002/1521-4095(200012)12:23<1769::aid-adma1769>3.0.co;2-5