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Developing diffusion bonding windows for joining AZ31B magnesium and copper alloys

✍ Scribed by G. Mahendran; V. Balasubramanian; T. Senthilvelan


Book ID
105852853
Publisher
Springer
Year
2008
Tongue
English
Weight
455 KB
Volume
42
Category
Article
ISSN
0268-3768

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Developing diffusion bonding windows for
✍ G. Mahendran; V. Balasubramanian; T. Senthilvelan πŸ“‚ Article πŸ“… 2009 πŸ› Elsevier Science βš– 731 KB

The principal difficulty when joining Magnesium (Mg)-Aluminium (Al) lies in the existence of formation of oxide films and brittle intermetallic in the bond region. However, diffusion bonding can be used to join these alloys without much difficulty. In this investigation, an attempt was made to devel