✦ LIBER ✦
Determining adhesion and hermeticity of the interface between encapsulation polymer and insulating layer of micro-sensing chips via a capacitance–voltage technique
✍ Scribed by Yu-Sheng Lin; Jyh-Ming Ting; Tse-Chuan Chou; Chien-Cheng Li; Jow-Lay Huang
- Book ID
- 108289625
- Publisher
- Elsevier Science
- Year
- 2007
- Tongue
- English
- Weight
- 337 KB
- Volume
- 515
- Category
- Article
- ISSN
- 0040-6090
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