Smoothly polished single-crystal silicon plates were cut by wire electrical discharge machining (WEDM) in water and in oil in order to investigate the effect of WEDM on the polished surfaces. For cutting in water, polished surfaces near cut sections have chips and cracks, and are extremely rough; th
โฆ LIBER โฆ
Determination of optimal cutting parameters in wire electrical discharge machining
โ Scribed by Y.S. Tarng; S.C. Ma; L.K. Chung
- Publisher
- Elsevier Science
- Year
- 1995
- Tongue
- English
- Weight
- 535 KB
- Volume
- 35
- Category
- Article
- ISSN
- 0890-6955
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