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Detection of solder bump defects on a flip chip using vibration analysis

✍ Scribed by Junchao Liu; Tielin Shi; Qi Xia; Guanglan Liao

Book ID: 107378525
Publisher: Springer-Verlag
Year: 2012
Tongue: English
Weight: 565 KB
Volume: 7
Category: Article
ISSN: 2095-0233
DOI: 10.1007/s11465-012-0314-7

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