Design of a high performance DIP-like pin array package for logic devices: Cecil W. Deisch, John F. Gogal and John W. Stafford IEEE Trans. Components Hybrids Mfg Technol. Chmt-6(3), 305 (September 1983)

• Publisher: Elsevier Science
• Year: 1987
• Tongue: English
• Weight: 104 KB
• Volume: 18
• Category: Article
• ISSN: 0026-2692
• DOI: 10.1016/s0026-2692(87)80416-0