✦ LIBER ✦
Deposition of uniform and well adhesive diamond layers on planar tungsten copper substrates for heat spreading applications
✍ Scribed by A. Glaser; H.G. Jentsch; S.M. Rosiwal; A. Lüdtke; R.F. Singer
- Publisher
- Elsevier Science
- Year
- 2006
- Tongue
- English
- Weight
- 394 KB
- Volume
- 127
- Category
- Article
- ISSN
- 0921-5107
No coin nor oath required. For personal study only.