Dendrimers with Thermally Labile End Groups: An Alternative Approach to Chemically Amplified Resist Materials Designed for Sub-100 nm Lithography

✍ Scribed by D. C. Tully; A. R. Trimble; J. M. J. Fréchet

• Publisher: John Wiley and Sons
• Year: 2000
• Tongue: English
• Weight: 264 KB
• Volume: 12
• Category: Article
• ISSN: 0935-9648
• DOI: 10.1002/1521-4095(200008)12:15<1118::aid-adma1118>3.0.co;2-i