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Demonstration of grain growth induced Microcracking and its role in the electrical response of YBa2Cu3O7 − δ

✍ Scribed by D.S. Smith; S. Suasmoro; C. Gault

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Simulations of the kinetic growth of YBa

✍ R. Cloots; N. Vandewalle; M. Ausloos 📂 Article 📅 1996 🏛 Elsevier Science 🌐 English ⚖ 323 KB

Electrical transport across grain bounda

✍ D.C. Larbalestier; S.E. Babcock; X.Y. Cai; M.B. Field; Y. Gao; N.F. Heinig; D.L. 📂 Article 📅 1991 🏛 Elsevier Science 🌐 English ⚖ 476 KB

Doping-induced enhancement of the critic

✍ Schmehl, A; Goetz, B; Schulz, R. R; Schneider, C. W; Bielefeldt, H; Hilgenkamp, 📂 Article 📅 1999 🏛 EDP Sciences 🌐 English ⚖ 345 KB

XPS study of the grain boundary phase in

✍ F. Stucki; P. Brüesch; Th. Baumann 📂 Article 📅 1988 🏛 Elsevier Science 🌐 English ⚖ 525 KB

Grain growth and seeding of thick films

✍ D.N. Matthews; N. Sakai; M. Murakami; G.J. Russell 📂 Article 📅 1995 🏛 Elsevier Science 🌐 English ⚖ 760 KB

On the role of dislocations in heavily s

✍ M. Verwerft; D.K. Dijken; J.Th.M. de Hosson; A.C. van der Steen 📂 Article 📅 1994 🏛 Elsevier Science 🌐 English ⚖ 987 KB