✦ LIBER ✦
Deformations of a simplified flip chip structure under thermal testing inspected using a real-time Moiré technique
✍ Scribed by Z.W. Zhong; K.W. Wong; X.Q. Shi
- Book ID
- 105850973
- Publisher
- Springer
- Year
- 2005
- Tongue
- English
- Weight
- 544 KB
- Volume
- 27
- Category
- Article
- ISSN
- 0268-3768
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