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Defect formation mechanism during plasma enhanced chemical vapor deposition of undoped a-Si:H

✍ Scribed by Keiji Maeda; Ikurou Umezu


Book ID
117148975
Publisher
Elsevier Science
Year
1998
Tongue
English
Weight
106 KB
Volume
227-230
Category
Article
ISSN
0022-3093

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## Abstract Nanocrystalline‐silicon embedded silicon oxide films are prepared by plasma‐enhanced chemical vapor deposition (PECVD) at 300 Β°C without post‐heat treatment. Measurements of XPS, IR, XRD, and HREM are performed. Microstructural modifications are found occurring throughout the film depos