Decomposition Kinetics, Life Estimation, and Dielectric Study of an Acrylate based Photopolymer for Microfabrication and Photonic Applications
✍ Scribed by Le Huong Nguyen; Min Gu
- Publisher
- John Wiley and Sons
- Year
- 2005
- Tongue
- English
- Weight
- 125 KB
- Volume
- 206
- Category
- Article
- ISSN
- 1022-1352
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✦ Synopsis
Abstract
Summary: Kinetics of thermal decomposition of the acrylate‐based photopolymer LN1 for microfabrication was studied with dynamic thermogravimetric analysis experiments. The kinetic parameters including the activation energy, pre‐exponential factor, and rate constant, which were calculated by the Flynn and Wall method, are presented. The results indicate that thermal degradation of the material consists of three distinct reaction stages. A mechanism of thermal decomposition was proposed, which is in good agreement with the experimental results. The lifetime of the material was estimated by the method of Toop, giving the key information for microelectronics and photonic applications. In addition, the curing behavior of the system was studied by dielectric analysis providing valuable information for processing and fabrication control.
Conversion time versus temperature (a), percentage conversion versus time (b).
imageConversion time versus temperature (a), percentage conversion versus time (b).