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De-tethering of high aspect ratio metallic and polymeric MEMS/NEMS parts for the direct pick-and-place assembly of 3D microsystem

✍ Scribed by Karthik S. Colinjivadi; Yonghao Cui; Matthew Ellis; George Skidmore; Jeong-Bong Lee


Publisher
Springer-Verlag
Year
2008
Tongue
English
Weight
445 KB
Volume
14
Category
Article
ISSN
0946-7076

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