✦ LIBER ✦

Data mining for improving the solder bumping process in the semiconductor packaging industry

✍ Scribed by Chen-fu Chien; Huan-chung Li; Angus Jeang

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Application of Six Sigma Methods for Imp

✍ Christopher M. French; Neno Duplancic 📂 Article 📅 2006 🏛 John Wiley and Sons 🌐 English ⚖ 476 KB

A data mining approach considering missi

✍ Doh-Soon Kwak; Kwang-Jae Kim 📂 Article 📅 2012 🏛 Elsevier Science 🌐 English ⚖ 449 KB

Data mining for quality control: Burr de

✍ Susana Ferreiro; Basilio Sierra; Itziar Irigoien; Eneko Gorritxategi 📂 Article 📅 2011 🏛 Elsevier Science 🌐 English ⚖ 480 KB

Cross-Industry Standard Process for data

✍ Eduardo Rivo; Javier de la Fuente; Ángel Rivo; Eva García-Fontán; Miguel-Ángel C 📂 Article 📅 2012 🏛 Springer Milan 🌐 Spanish ⚖ 280 KB

A dense vapour dispersion code package f

✍ J. Würtz; J. Bartzis; A. Venetsanos; S. Andronopoulos; J. Statharas; R. Nijsing 📂 Article 📅 1996 🏛 Elsevier Science 🌐 English ⚖ 717 KB

Data Mining by Total Ranking Methods: A

✍ Manuela Pavan; Roberto Todeschini; Marco Orlandi 📂 Article 📅 2006 🏛 John Wiley and Sons 🌐 English ⚖ 104 KB 👁 3 views