✦ LIBER ✦
Damageless Cu chemical mechanical polishing for porous SiOC/Cu interconnects
✍ Scribed by Seiichi Kondo; Kouichi Fukaya; Kouji Yamada; Tadakazu Miyazaki; Masahisa Fujita; Daisuke Abe; Shuuji Kunisaki; Taro Enomoto; Shigeru Tominaga
- Book ID
- 104051789
- Publisher
- Elsevier Science
- Year
- 2007
- Tongue
- English
- Weight
- 632 KB
- Volume
- 84
- Category
- Article
- ISSN
- 0167-9317
No coin nor oath required. For personal study only.