✦ LIBER ✦
Damage to Si substrates during SiO2 etching: Opportunities of subsequent removal by optimized cleaning procedures
✍ Scribed by HH Richter; A Wolff; K Blum; K Hoeppner; D Krüger; R Sorge
- Publisher
- Elsevier Science
- Year
- 1996
- Tongue
- English
- Weight
- 690 KB
- Volume
- 47
- Category
- Article
- ISSN
- 0042-207X
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