Damage analysis of 2D C/SiC composites subjected to thermal cycling in oxidizing environments by mechanical and electrical characterization

✍ Scribed by Hui Mei; Laifei Cheng

• Book ID: 116730821
• Publisher: Elsevier Science
• Year: 2005
• Tongue: English
• Weight: 290 KB
• Volume: 59
• Category: Article
• ISSN: 0167-577X
• DOI: 10.1016/j.matlet.2005.05.052