The cyclic stress-strain response of polycrystalline copper has been explored at low strain amplitudes by means of two multistep tests. In one called the 'large step test', Program A, cycling is first begun at 2 x lo-' to create a cell structure in saturation and thereafter tests were conducted on t
Cyclic stress-strain response of polycrystalline copper in constant and variable amplitude fatigue
β Scribed by V.-T. Kuokkala; P. Kettunen
- Publisher
- Elsevier Science
- Year
- 1985
- Weight
- 822 KB
- Volume
- 33
- Category
- Article
- ISSN
- 0001-6160
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β¦ Synopsis
Cyclic stress-strain response of polycrystalline copper of two different grain sizes was studied in constant, incremental step and variable plastic strain amplitude fatigue tests. The multi-regime css curves of largcgraincd samples exhibited short but distinct plateaus both in constant and variable amplitude tests, but not in the incremental step tests. With small-grained samplea, the css curve of random amplitude tests did not show the plateau but only a region with a small positive slope. The ef&tivc amplitude of the random squan distributed loading block was estimated to be about 25% below the maximum amplitude of the block. R&amn&Nous avons &t&i& la r&onse ~nt~n~fo~tion cychquc de palycristaux de cuivre de dewi di&entcs gromeum de grains, Par des cm& de fatigue B amplitude de d&formation plastiquc consbutte, en &aPrs croimantcs, et B amplitude variable. Les courbcs CDC dcs 6chantiilons i gros grains ont fait voir de courts, mais disthtcts plateaux, aussi bicn dans ks es& H amplitude constame que dans caux i amplitude variable, mair pas dans les essais B &apes croissantca. Pour ks cC~tiU0~ i grains Anr, la courhe CDC des c&s i amplitudss prigs au has&, nous n'avons pas observ6 dc plateau, mais scukunent uric r&ion avcc une &g&e lnclinaison positive. L'amplitudc &ctivc de s+mcnt de @ r&pandu uniform&mcnt a c1c atim& ctm environ 25% au dcssous de l'amplitude maxim& du &merit.
π SIMILAR VOLUMES
The strain-rate sensitivity of flow stress (3X7 Γ 10 Γ3 s Γ1 3X7 Γ 10 Γ4 s Γ1 ) in fine-grain polycrystalline copper has been studied over the entire stressΒ±strain curve at room temperature. It is observed that the yield stress varies with mean grain diameter (32 to 59 mm) in accord with the Hall-Pe