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Cyclic creep and fracture of a Cu–SiO2 bicrystal at an intermediate temperature of 673 K

✍ Scribed by H. Miura; T. Sakai; M. Kato


Publisher
Elsevier Science
Year
2009
Tongue
English
Weight
661 KB
Volume
510-511
Category
Article
ISSN
0921-5093

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