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Current collapse reduction in InAlN/GaN MOS HEMTs by in situ surface pre-treatment and atomic layer deposition of ZrO2 high-k gate dielectrics

✍ Scribed by Abermann, S.; Pozzovivo, G.; Kuzmik, J.; Ostermaier, C.; Henkel, C.; Bethge, O.; Strasser, G.; Pogany, D.; Carlin, J.-F.; Grandjean, N.; Bertagnolli, E.


Book ID
120328950
Publisher
The Institution of Electrical Engineers
Year
2009
Tongue
English
Weight
230 KB
Volume
45
Category
Article
ISSN
0013-5194

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