Curing reaction of biphenyl epoxy resin with different phenolic functional hardeners

✍ Scribed by Seung Han; Whan Gun Kim; Ho Gyu Yoon; Tak Jin Moon

• Publisher: John Wiley and Sons
• Year: 1998
• Tongue: English
• Weight: 257 KB
• Volume: 36
• Category: Article
• ISSN: 0887-624X
• DOI: 10.1002/(sici)1099-0518(19980415)36:5<773::aid-pola10>3.0.co;2-d

✦ Synopsis

The investigation of cure kinetics and relationships between glass transition temperature and conversion of biphenyl epoxy resin (4,4 -diglycidyloxy-3,3 ,5,5tetramethyl biphenyl) with different phenolic hardeners was performed by differential scanning calorimeter using an isothermal approach over the temperature range 120-150ЊC. All kinetic parameters of the curing reaction including the reaction order, activation energy, and rate constant were calculated and reported. The results indicate that the curing reaction of formulations using xylok and dicyclopentadiene type phenolic resins (DCPDP) as hardeners proceeds through a first-order kinetic mechanism, whereas the curing reaction of formulations using phenol novolac as a hardener goes through an autocatalytic kinetic mechanism. The differences of curing reaction with the change of hardener in biphenyl epoxy resin systems were explained with the relationships between T g and reaction conversion using the DiBenedetto equation. A detailed cure mechanism in biphenyl-type epoxy resin with the different hardeners has been suggested.