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Curing process of phenol-urea-formaldehyde-tannin (PUFT) adhesives

✍ Scribed by G. Vázquez; F. López-Suevos; J. González-Alvarez; G. Antorrena


Publisher
Springer Netherlands
Year
2005
Tongue
English
Weight
622 KB
Volume
82
Category
Article
ISSN
0022-5215

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✍ Milan Sernek; Frederick A. Kamke 📂 Article 📅 2007 🏛 Elsevier Science 🌐 English ⚖ 238 KB

Dielectric analysis (DEA) was conducted for continuous in-process monitoring of the curing of phenol formaldehyde (PF) adhesive. The influence of wood moisture content (MC) on the dielectric signal obtained in the PF adhesive bond was examined. The cure kinetics of the PF adhesive was evaluated at f