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Curing of epoxy resin with poly(m-phenylene methylphosphonate)

✍ Scribed by Tao Wu; Andrew M. Piotrowski; Qiang Yao; Sergei V. Levchik

Publisher
John Wiley and Sons
Year
2006
Tongue
English
Weight
176 KB
Volume
101
Category
Article
ISSN
0021-8995

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