Curing kinetic analysis of phenolic resin filled with nonmetallic materials reclaimed from waste printed circuit boards

✍ Scribed by Guo, Jie; Lin, Kuangfei; Xu, Zhenming

• Book ID: 121232521
• Publisher: Elsevier Science
• Year: 2013
• Tongue: English
• Weight: 559 KB
• Volume: 556
• Category: Article
• ISSN: 0040-6031
• DOI: 10.1016/j.tca.2013.01.006