✦ LIBER ✦
Curing conditions effects on the characteristics of thermosetting adhesives-bonded wood joints — Part 1: Substrate influence on TTT and CHT curing diagrams of wood adhesives
✍ Scribed by X. Lu; A. Pizzi
- Publisher
- Springer-Verlag
- Year
- 1998
- Tongue
- English
- Weight
- 83 KB
- Volume
- 56
- Category
- Article
- ISSN
- 0018-3768
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