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Curing behavior of epoxy resin having hydroxymethyl group and different molecular weight distribution

✍ Scribed by K. Ohtsuka; K. Hasegawa; A. Fukuda; K. Uede

Publisher: John Wiley and Sons
Year: 1992
Tongue: English
Weight: 287 KB
Volume: 44
Category: Article
ISSN: 0021-8995
DOI: 10.1002/app.1992.070440906

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