✦ LIBER ✦
Curing behavior and residual stresses in polymeric resins used for encapsulanting electronic packages
✍ Scribed by Man-Lung Sham; Jang-Kyo Kim
- Publisher
- John Wiley and Sons
- Year
- 2005
- Tongue
- English
- Weight
- 159 KB
- Volume
- 96
- Category
- Article
- ISSN
- 0021-8995
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