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Cure shrinkage measurement of nonconductive adhesives by means of a thermomechanical analyzer

✍ Scribed by H. Yu; S. G. Mhaisalkar; E. H. Wong

Book ID: 107453497
Publisher: Springer US
Year: 2005
Tongue: English
Weight: 119 KB
Volume: 34
Category: Article
ISSN: 0361-5235
DOI: 10.1007/s11664-005-0248-5

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