✦ LIBER ✦
Cure Properties of Naphthalene-Based Epoxy Resin Systems with Hardeners and Latent Catalysts for Semiconductor Packaging Materials
✍ Scribed by Kim, Whan Gun; Chun, Hyunaee
- Book ID
- 121334632
- Publisher
- Taylor and Francis Group
- Year
- 2013
- Tongue
- English
- Weight
- 822 KB
- Volume
- 579
- Category
- Article
- ISSN
- 1542-1406
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