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Cure behavior of epoxy resin/CdS/2,4-EMI nanocomposites investigated by dynamic torsional vibration method (DTVM)

✍ Scribed by Yao Yuan; Chen Dazhu; He Pingsheng; Yang Haiyang

Book ID: 106001046
Publisher: Springer
Year: 2006
Tongue: English
Weight: 347 KB
Volume: 57
Category: Article
ISSN: 0170-0839
DOI: 10.1007/s00289-006-0550-2

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