CuCl adlayer formation and Cl induced surface alloying: An in situ STM study on Cu underpotential deposition on Au(110) electrode surfaces
✍ Scribed by F. Möller; O.M. Magnussen; R.J. Behm
- Publisher
- Elsevier Science
- Year
- 1995
- Tongue
- English
- Weight
- 849 KB
- Volume
- 40
- Category
- Article
- ISSN
- 0013-4686
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✦ Synopsis
underpotential deposition on Au(llO), in pure and Cll containing H,SO, solution, was investigated by in situ STM. In the absence of Cl-the general surface topography and the (1 x 1) structure of the nonreconstructed surface are maintained over the entire upd potential range. This is interpreted as formation of a (1 x 1) Cu adlayer, with weak and presumably slightly repulsive adsorbate-adsorbate interactions.
In Cl-containing electrolyte a (2 x 1) structure is reversibly formed at potentials below 0.27 V,, , coincident with a sharp peak in the cyclic voltammograms and the appearance of anisotropic,
[OOl] oriented Au adlayer islands and monolayer holes on the previously flat terraces. A model based on the CuCl(111) bilayer is suggested for the (2 x 1) structure and compared to adlayer structures on Au(ll1) and ( 100). The roughening is interpreted as anion induced surface alloying.