✦ LIBER ✦
Cubic TaN diffusion barrier for Cu interconnects using an ultra-thin TiN seed layer
✍ Scribed by Roy A. Araujo; Jongsik Yoon; Xinghang Zhang; Haiyan Wang
- Book ID
- 108290026
- Publisher
- Elsevier Science
- Year
- 2008
- Tongue
- English
- Weight
- 493 KB
- Volume
- 516
- Category
- Article
- ISSN
- 0040-6090
No coin nor oath required. For personal study only.