Cryogenic evaluation of epoxy bond strength

✍ Scribed by N. Albritton; W. Young

• Publisher: Elsevier Science
• Year: 1996
• Tongue: English
• Weight: 464 KB
• Volume: 36
• Category: Article
• ISSN: 0011-2275
• DOI: 10.1016/0011-2275(96)00067-7

✦ Synopsis

The purpose of the work presented here was to determine methods of optimizing the adhesion of a particular epoxy (CTD-IOIK, Composite Technology Development Inc.) to a particular nickel-based alloy substrate (Incoloy8 908, lnco Alloys International) for cryogenic applications. Initial efforts were focused on surface preparation of the substrate material via various mechanical and chemical cleaning techniques. Test samples, fabricated to simulate the conduit-to-insulation interface, were put through a mock heat treat and vacuum/pressure impregnation process. Samples were compression/shear load tested to compare the bond strengths at room temperature and liquid nitrogen temperature. The resulting data indicate that acid etching creates a higher bond strength than the other tested techniques and that the bond formed is stronger at cryogenic temperatures than at room temperature. A description of the experiment along with the resulting data is presented here. 01996 Elsevier Science Limited