Creep Life Assessment of Tin-Based Lead-Free Solders Based on Imaginary Initial Strain Rate

✍ Scribed by Kenji Monden

• Publisher: Springer US
• Year: 2007
• Tongue: English
• Weight: 531 KB
• Volume: 36
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-007-0285-3