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Creep fatigue. III. Diercks equation: modification and applicability : Goswami, T. High Temp. Mater. Process (Jan. 1995) 14 (1), 35–45

Publisher: Elsevier Science
Year: 1996
Tongue: English
Weight: 160 KB
Volume: 18
Category: Article
ISSN: 0142-1123
DOI: 10.1016/0142-1123(96)82914-8

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