✦ LIBER ✦
Creep deformation behavior in eutectic Sn-Ag solder joints using a novel mapping technique
✍ Scribed by J. P. Lucas; F. Guo; J. McDougall; T. R. Bieler; K. N. Subramanian; J. K. Park
- Publisher
- Springer US
- Year
- 1999
- Tongue
- English
- Weight
- 362 KB
- Volume
- 28
- Category
- Article
- ISSN
- 0361-5235
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