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Creep-constitutive behavior of Sn-3.8Ag-0.7Cu solder using an internal stress approach

✍ Scribed by Martin A. Rist; W. J. Plumbridge; S. Cooper

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Phase equilibria studies of Sn-Ag-Cu eut

✍ Jae-Yong Park; Choong-Un Kim; Ted Carper; Viswanadham Puligandla 📂 Article 📅 2003 🏛 Springer US 🌐 English ⚖ 569 KB

Solidification Condition Effects on Micr

✍ J. Liang; N. Dariavach; D. Shangguan 📂 Article 📅 2007 🏛 The Minerals, Metals & Materials Society 🌐 English ⚖ 840 KB