✦ LIBER ✦
Creep and stress relaxation in solder joints of surface-mounted chip carriers : Peter M. Hall. IEEE Trans. Compon. Hybrids mfg Technol.CHMT-12, 556 (1987)
- Publisher
- Elsevier Science
- Year
- 1989
- Tongue
- English
- Weight
- 135 KB
- Volume
- 29
- Category
- Article
- ISSN
- 0026-2714
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