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Cover Picture: Texture Evolution During Bending of a Single Crystal Copper Nanowire Studied by EBSD and Crystal Plasticity Finite Element Simulations (Adv. Eng. Mater. 8/2008)

โœ Scribed by F. Weber; I. Schestakow; F. Roters; D. Raabe


Publisher
John Wiley and Sons
Year
2008
Tongue
English
Weight
568 KB
Volume
10
Category
Article
ISSN
1438-1656

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Texture Evolution During Bending of a Si
โœ F. Weber; I. Schestakow; F. Roters; D. Raabe ๐Ÿ“‚ Article ๐Ÿ“… 2008 ๐Ÿ› John Wiley and Sons ๐ŸŒ English โš– 862 KB

Due to the gradual size reduction of engineering products, micro-and nanomechanical testing procedures are becoming more important. Many modern devices approach grain scale dimensions, e.g. MEMS, stents, microcantilevers and compounds in electronic packaging. Therefore, better understanding of cryst