Texture Evolution During Bending of a Si
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F. Weber; I. Schestakow; F. Roters; D. Raabe
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Article
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2008
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John Wiley and Sons
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English
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Due to the gradual size reduction of engineering products, micro-and nanomechanical testing procedures are becoming more important. Many modern devices approach grain scale dimensions, e.g. MEMS, stents, microcantilevers and compounds in electronic packaging. Therefore, better understanding of cryst