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Coupled mesoscale—continuum simulations of copper electrodeposition in a trench

✍ Scribed by Timothy O. Drews; Eric G. Webb; David L. Ma; Jay Alameda; Richard D. Braatz; Richard C. Alkire


Publisher
American Institute of Chemical Engineers
Year
2004
Tongue
English
Weight
346 KB
Volume
50
Category
Article
ISSN
0001-1541

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