Coupled finite-element-analytic technique for prediction of temperature rise in power apparatus

✍ Scribed by Kim, S.W.; Kim, H.H.; Hahn, S.C.; Lee, B.Y.; Park, K.Y.; Shin, Y.J.; Song, W.P.; Kim, J.B.; Shin, I.H.

• Book ID: 111657139
• Publisher: IEEE
• Year: 2002
• Tongue: English
• Weight: 312 KB
• Volume: 38
• Category: Article
• ISSN: 0018-9464
• DOI: 10.1109/20.996237