Coupled Data Communication Techniques for High-Performance and Low-Power Computing

✍ Scribed by Dr. Ron Ho, Dr. Robert Drost (auth.), Ron Ho, Robert Drost (eds.)

• Publisher: Springer US
• Year: 2010
• Tongue: English
• Leaves: 214
• Series: Integrated Circuits and Systems
• Edition: 1
• Category: Library

✦ Synopsis

Designers of next-generation high-performance computer systems face a host of technical challenges. For the past several decades, rising clock frequencies and increased chip integration have fueled the growth of computer performance. Now these trends have slowed: power and complexity constrains further increases in clock frequencies, and economic realities limit the pace of Moore's Law. Coupled data communication provides a way forward, and this book, Coupled Data Communication Techniques for High-Performance and Low-Power Computing, gives a comprehensive overview for such coupled data techniques. Coupled data communication allows chips to communicate—capacitively or inductively—over short distances between chips without solder, and fundamentally shifts the design paradigm from single-chip integration to single-package integration. This book covers the state-of-the-art in the circuits, architectures, and chip packaging for this novel chip-to-chip communication technology and showcases its potential to drive the coming decades of industry growth. Coupled Data Communication Techniques for High-Performance and Low-Power Computing should be of interest to students and designers in circuits and system architecture.

✦ Table of Contents

Front Matter....Pages i-xvi
Front Matter....Pages 1-1
Introduction to Coupled Data Technologies....Pages 3-10
Front Matter....Pages 12-12
Power delivery, signaling and cooling for 2D and 3D integrated systems....Pages 13-48
Front Matter....Pages 50-50
Capacitive Coupled Communication....Pages 51-77
Inductive Coupled Communications....Pages 79-125
Use of AC Coupled Interconnect in Contactless Packaging....Pages 127-153
Front Matter....Pages 156-156
Aligning chips face-to-face for dense capacitive communication....Pages 157-175
Front Matter....Pages 178-178
Delivering On-chip Bandwidth Off-chip and Out-of-box with Proximity and Optical Communication....Pages 179-192
AC Coupled Wireless Power Delivery....Pages 193-204
Back Matter....Pages 205-206

✦ Subjects

Circuits and Systems; Electronics and Microelectronics, Instrumentation; Electrical Engineering; Computer Hardware