✦ LIBER ✦
Cost effective flip chip assembly and interconnection technologies for large area pixel sensor applications
✍ Scribed by T. Fritzsch; R. Jordan; H. Oppermann; O. Ehrmann; M. Töpper; T. Baumgartner; K.-D. Lang
- Book ID
- 113821751
- Publisher
- Elsevier Science
- Year
- 2011
- Tongue
- English
- Weight
- 830 KB
- Volume
- 650
- Category
- Article
- ISSN
- 0168-9002
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