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Corrosion inhibition by self-assembled monolayers for enhanced wire bonding on Cu surfaces

✍ Scribed by Caroline M. Whelan; Michael Kinsella; Laureen Carbonell; Hong Meng Ho; Karen Maex


Book ID
104305896
Publisher
Elsevier Science
Year
2003
Tongue
English
Weight
256 KB
Volume
70
Category
Article
ISSN
0167-9317

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✦ Synopsis


Corrosion inhibition by thiol-derived self-assembled monolayers (SAMs) on Cu surfaces has been characterised using contact angle measurements, X-ray photoelectron spectroscopy, voltammetry, and thermal desorption spectroscopy. Factors influencing SAM formation were investigated to develop an optimised wafer level process. XPS confirms the formation of thiolate species bonded to a mixed metallic Cu and cuprous oxide surface. Stability studies as a function of temperature and electrochemical potential demonstrate promising passivation properties. The feasibility of exploiting SAMs in microelectronics applications was demonstrated by the enhancement of Cu wire bonding onto Cu bond pads.


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