Corrosion inhibition by self-assembled monolayers for enhanced wire bonding on Cu surfaces
β Scribed by Caroline M. Whelan; Michael Kinsella; Laureen Carbonell; Hong Meng Ho; Karen Maex
- Book ID
- 104305896
- Publisher
- Elsevier Science
- Year
- 2003
- Tongue
- English
- Weight
- 256 KB
- Volume
- 70
- Category
- Article
- ISSN
- 0167-9317
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β¦ Synopsis
Corrosion inhibition by thiol-derived self-assembled monolayers (SAMs) on Cu surfaces has been characterised using contact angle measurements, X-ray photoelectron spectroscopy, voltammetry, and thermal desorption spectroscopy. Factors influencing SAM formation were investigated to develop an optimised wafer level process. XPS confirms the formation of thiolate species bonded to a mixed metallic Cu and cuprous oxide surface. Stability studies as a function of temperature and electrochemical potential demonstrate promising passivation properties. The feasibility of exploiting SAMs in microelectronics applications was demonstrated by the enhancement of Cu wire bonding onto Cu bond pads.
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