Corrosion Behavior of Ultra Fine Grain Copper Produced by Accumulative Roll Bonding Process
β Scribed by Nikfahm, A.; Danaee, I.; Ashrafi, A.; Toroghinejad, M. R.
- Book ID
- 121694332
- Publisher
- Springer-Verlag
- Year
- 2013
- Tongue
- English
- Weight
- 1022 KB
- Volume
- 67
- Category
- Article
- ISSN
- 0972-2815
No coin nor oath required. For personal study only.
π SIMILAR VOLUMES
Accumulative roll bonding (ARB) process is a severe plastic deformation (SPD) process that has been used for pure copper (99.9%). The ARB process up to 8 cycles was performed at ambient temperature under unlubricated conditions. Microstructural characterizations were done by transmission electron mi
Mechanical behavior of AA1100 aluminum alloy processed by accumulative roll-bonding was modeled on the basis of a generalized three-dimensional dislocation-density-based two-phase composite model. The simulated yield stress and cell size were compared with the experimental data, obtained by accumula