𝔖 Bobbio Scriptorium
✦   LIBER   ✦

Correlation between barrier integrity and TDDB performance of copper porous low-k interconnects

✍ Scribed by Zs. Tőkei; M. Patz; M. Schmidt; F. Iacopi; S. Demuynck; K. Maex


Book ID
108207366
Publisher
Elsevier Science
Year
2004
Tongue
English
Weight
379 KB
Volume
76
Category
Article
ISSN
0167-9317

No coin nor oath required. For personal study only.