✦ LIBER ✦
Correlation analysis between pattern and non-pattern wafer for characterization of shallow trench isolation–chemical–mechanical polishing (STI–CMP) process
✍ Scribed by Sang-Yong Kim; Yong-Jin Seo
- Book ID
- 108411201
- Publisher
- Elsevier Science
- Year
- 2002
- Tongue
- English
- Weight
- 656 KB
- Volume
- 60
- Category
- Article
- ISSN
- 0167-9317
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