Corrections to “Analytical Expressions for High-Frequency VLSI Interconnect Impedance Extraction in the Presence of a Multilayer Conductive Substrate” [Jul 09 1047-1060]

✍ Scribed by Srivastava, N.; Xu, C.; Suaya, R.; Banerjee, K.

• Book ID: 117908433
• Publisher: IEEE
• Year: 2010
• Tongue: English
• Weight: 43 KB
• Volume: 29
• Category: Article
• ISSN: 0278-0070
• DOI: 10.1109/tcad.2010.2047753