Copper/polyimide fabrication process for above-IC integration of high quality factor inductors

✍ Scribed by M.B. Pisani; C. Hibert; D. Bouvet; P. Beaud; A.M. Ionescu

• Book ID: 113797661
• Publisher: Elsevier Science
• Year: 2004
• Tongue: English
• Weight: 488 KB
• Volume: 73-74
• Category: Article
• ISSN: 0167-9317
• DOI: 10.1016/j.mee.2004.03.020