Copper–dielectric cap interface with enhanced reliability for 45 nm technology and beyond

✍ Scribed by J. Hohage; U. Mayer; M.U. Lehr; F. Feustel; O. Aubel; C. Hennesthal

• Book ID: 104052659
• Publisher: Elsevier Science
• Year: 2010
• Tongue: English
• Weight: 516 KB
• Volume: 87
• Category: Article
• ISSN: 0167-9317
• DOI: 10.1016/j.mee.2010.01.011